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		FORCE sensors for microelectronic packaging applications J. Schwizer ...[et.al]., by Brand, O Mayer, M Material type: Text; Format: print ; Literary form: Not fiction Publication details: Berlin, London Springer 2004 Availability: Items available for loan: PERPUSTAKAAN TAN SRI OTHMAN MERICAN, POLITEKNIK UNGKU OMAR (1)Call number: 621.3810 FOR. Place hold Add to cart (remove)
		CERAMIC interconnect technology handbook edited by Fred D. Barlow, Aicha Elshabini by xx, 686 p. ill. 24 cm Barlow, Fred D Elshabini, Aicha Title Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boca Raton CRC Press/Taylor & Francis c2007 Availability: Items available for loan: PERPUSTAKAAN TAN SRI OTHMAN MERICAN, POLITEKNIK UNGKU OMAR (1)Call number: 621.381 CER. Place hold Add to cart (remove)
		MICROELECTRONICS technology polymers for advanced imaging and packaging edited by Elsa Reichmanis ...[et.al]., by xx, 686 p. ill. 24 cm Reichmanis, Elsa Title Material type: Text; Format: print ; Literary form: Not fiction Publication details: Washington, DC American Chemical Society C1995 Availability: Items available for loan: PERPUSTAKAAN TAN SRI OTHMAN MERICAN, POLITEKNIK UNGKU OMAR (1)Call number: 621.381 MIC. Place hold Add to cart (remove)
		Electronic techniques shop practices and construction Robert S. Villanucci, Alexander W. Avtgis, William F. Megow. by Villanucci, Robert S xx, 686 p. ill. 24 cm Avtgis, Alexander W Title Material type: Text; Format: print ; Literary form: Not fiction Publication details: Englewood Cliffs, N.J., Prentice-Hall 1974 Availability: Items available for loan: PERPUSTAKAAN TAN SRI OTHMAN MERICAN, POLITEKNIK UNGKU OMAR (2)Call number: 621.381 VIL, ... Place hold Add to cart (remove)
		No cover image available NFPA handbook of the National electrical code Based on the current 1975 Code Wilford I. Summers by Summers, Wilford I xx, 686 p. ill. 24 cm Title Edition: 4th.ed. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York McGraw-Hill [n.d.] Availability: Items available for loan: PERPUSTAKAAN TAN SRI OTHMAN MERICAN, POLITEKNIK UNGKU OMAR (1)Call number: 621.302 SUM. Place hold Add to cart (remove)
		Practical guide to the packaging of electronics thermal and mechanical design and analysis Ali Jamnia. by Jamnia, Ali 1961- Title xx, 686 p. ill. 24 cm Edition: 2nd ed. Material type: Text; Format: print Publication details: Boca Raton CRC Press c2009 Availability: Items available for loan: PERPUSTAKAAN TAN SRI OTHMAN MERICAN, POLITEKNIK UNGKU OMAR (1)Call number: 621.3810 JAM. Place hold Add to cart (remove)
		Heat transfer thermal management of electronics Younes Shabany. by Shabany, Younes Title xx, 686 p. ill. 24 cm Material type: Text; Format: print Publication details: Boca Raton CRC Press c2010 Availability: Items available for loan: PERPUSTAKAAN TAN SRI OTHMAN MERICAN, POLITEKNIK UNGKU OMAR (1)Call number: 621.381 SHA. Place hold Add to cart (remove)
		Print and production finishes for packaging Edward Denison by Denison, Edward Title Material type: Text; Format: print Publication details: Hove, United Kingdom RotoVision 2008 Availability: Items available for loan: PERPUSTAKAAN TAN SRI OTHMAN MERICAN, POLITEKNIK UNGKU OMAR (2)Call number: 741.66 DEN, ... Place hold Add to cart (remove)